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TriQuint is proud to announce the latest additions to our innovative RF portfolio. View our New Products page to discover ways to simplify your RF designs across mobile, network infrastructure and defense applications.
TriQuint's QUANTUM Tx™ family of highly integrated transmit modules reduce board space and enable a much smaller footprint for 2G / 3G / 4G mobile devices. Find out how these building blocks can make RF design easier and faster for 2G and entry-level 3G devices.
TriQuint's innovative TriAccess™ portfolio enables more efficient broadband video, voice and data services. TriQuint amplifiers and filters lower power consumption with improved performance. TriQuint enables all major 75 ohm RF systems in headend, infrastructure, MDU and CPE applications.
Consumers have come to expect Wi-Fi connectivity in their smartphones, tablets and other mobile devices. You'll find TriQuint's TriConnect® Wi-Fi RF modules in many of the world's most sought-after products.
TRITIUM™ is a family of highly integrated modules designed for use in 3G mobile phones, data cards and USB modems. Optimize your 3G CDMA / WCDMA / HSUPA applications and gain maximum design flexibility.
TriQuint's highly integrated TRIUMF™ MMPAs are one more proven way that TriQuint engineers are delivering innovative solutions for the most complex mobile design challenges for cutting-edge smartphones. Let us help you simplify your 2G / 3G / 4G design and enhance system performance while speeding time to market.
Part # TQM679002A
The TriQuint TQM679002A is a full WLAN / Bluetooth front-end module in an ultra small 3 mm x 3 mm footprint package for 802.11 b / g / n and Bluetooth applications. The TQM679002A contains a 2.4 GHz power amplifier, directional detector, front-end switch, Bluetooth path and receive balun.
The architecture and interface are optimized for next generation WLAN integration into handset devices. The front-end module features CMOS compatible control voltages to facilitate ease of use. With its low power dissipation, the front-end module contributes to the extended battery life of next generation WLAN solutions. The front-end module is manufactured in TriQuint's high-reliability E/D pHEMT technology and is assembled in a thin profile 3 mm x 3 mm x 0.45 mm ETSLP-16 lead-free package.