Quickly and easily locate the part you need by selecting a product type.
TriQuint is proud to announce the latest additions to our innovative RF portfolio. View our New Products page to discover ways to simplify your RF designs across mobile, network infrastructure and defense applications.
TriQuint's QUANTUM Tx™ family of highly integrated transmit modules reduce board space and enable a much smaller footprint for 2G / 3G / 4G mobile devices. Find out how these building blocks can make RF design easier and faster for 2G and entry-level 3G devices.
TriQuint's innovative TriAccess™ portfolio enables more efficient broadband video, voice and data services. TriQuint amplifiers and filters lower power consumption with improved performance. TriQuint enables all major 75 ohm RF systems in headend, infrastructure, MDU and CPE applications.
Consumers have come to expect Wi-Fi connectivity in their smartphones, tablets and other mobile devices. You'll find TriQuint's TriConnect® Wi-Fi RF modules in many of the world's most sought-after products.
TRITIUM™ is a family of highly integrated modules designed for use in 3G mobile phones, data cards and USB modems. Optimize your 3G CDMA / WCDMA / HSUPA applications and gain maximum design flexibility.
TriQuint's highly integrated TRIUMF™ MMPAs are one more proven way that TriQuint engineers are delivering innovative solutions for the most complex mobile design challenges for cutting-edge smartphones. Let us help you simplify your 2G / 3G / 4G design and enhance system performance while speeding time to market.
Part # TGL8784-SCC
Last Time Buy
The TriQuint TGL8784-SCC is a monolithic variable attenuator which operates from 2 to 20 GHz. This analog attenuator can operate from a single +2.5 volt power supply if used with an external variable voltage divider circuit. Typical RF performance at 10 GHz includes an insertion loss of 2 dB, maximum attenuation of 15 dB at 10 GHz and input/output return loss of greater than 10 dB.
The device is an absorptive attenuator designed using MESFET technology employing a "PI" configuration which reduces bias currents and simplifies bias networks. The broadband capabilities of this device are versatile in many applications such as telecommunications, military and space. This device has a space heritage.
DC blocking capacitors are provided on-chip. Bond pad and backside metallization is gold plated for compatibility with eutectic attachment methods as well as thermocompression and thermosonic wire bonding processes. The TGL8784-SCC is supplied in chip form and is readily assembled using automated equipment. Ground is provided to the circuitry through vias the backside metallization.