Quickly and easily locate the part you need by selecting a product type.
TriQuint is proud to announce the latest additions to our innovative RF portfolio. View our New Products page to discover ways to simplify your RF designs across mobile, network infrastructure and defense applications.
TriQuint's QUANTUM Tx™ family of highly integrated transmit modules reduce board space and enable a much smaller footprint for 2G / 3G / 4G mobile devices. Find out how these building blocks can make RF design easier and faster for 2G and entry-level 3G devices.
TriQuint's innovative TriAccess™ portfolio enables more efficient broadband video, voice and data services. TriQuint amplifiers and filters lower power consumption with improved performance. TriQuint enables all major 75 ohm RF systems in headend, infrastructure, MDU and CPE applications.
Consumers have come to expect Wi-Fi connectivity in their smartphones, tablets and other mobile devices. You'll find TriQuint's TriConnect® Wi-Fi RF modules in many of the world's most sought-after products.
TRITIUM™ is a family of highly integrated modules designed for use in 3G mobile phones, data cards and USB modems. Optimize your 3G CDMA / WCDMA / HSUPA applications and gain maximum design flexibility.
TriQuint's highly integrated TRIUMF™ MMPAs are one more proven way that TriQuint engineers are delivering innovative solutions for the most complex mobile design challenges for cutting-edge smartphones. Let us help you simplify your 2G / 3G / 4G design and enhance system performance while speeding time to market.
Part # TGA8344-SCC
Last Time Buy Please use TGA2526 for new designs.
The TriQuint TGA8344-SCC features two cascaded monolithic low-noise distributed amplifiers with on-chip bias operating from 2 to 18 GHz. This die offers the advantage of high gain, typically 19 dB, in compact die size with simplified biasing configuration. Noise figure is typically 4 dB. The two cascade amplifiers have eighteen 122 um gate-width FETs providing 16 dBm of output power at 1 dB gain compression. Input return loss is typically 14 dB from 2 to 18 GHz and output return loss is typically 13 dB. Ground is provided to the circuitry through vias to the backside metallization.
The part's small size and high gain make it suitable for use in a variety of wide-band electronic commercial and warfare systems.
Bond pad and backside metallization is gold plated for compatibility with eutectic alloy attachment methods as well as the thermocompression wire bonding processes. The TGA8344-SCC is supplied in chip form and is readily assembled using automated equipment.