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TriQuint is proud to announce the latest additions to our innovative RF portfolio. View our New Products page to discover ways to simplify your RF designs across mobile, network infrastructure and defense applications.
TriQuint's QUANTUM Tx™ family of highly integrated transmit modules reduce board space and enable a much smaller footprint for 2G / 3G / 4G mobile devices. Find out how these building blocks can make RF design easier and faster for 2G and entry-level 3G devices.
TriQuint's innovative TriAccess™ portfolio enables more efficient broadband video, voice and data services. TriQuint amplifiers and filters lower power consumption with improved performance. TriQuint enables all major 75 ohm RF systems in headend, infrastructure, MDU and CPE applications.
Consumers have come to expect Wi-Fi connectivity in their smartphones, tablets and other mobile devices. You'll find TriQuint's TriConnect® Wi-Fi RF modules in many of the world's most sought-after products.
TRITIUM™ is a family of highly integrated modules designed for use in 3G mobile phones, data cards and USB modems. Optimize your 3G CDMA / WCDMA / HSUPA applications and gain maximum design flexibility.
TriQuint's highly integrated TRIUMF™ MMPAs are one more proven way that TriQuint engineers are delivering innovative solutions for the most complex mobile design challenges for cutting-edge smartphones. Let us help you simplify your 2G / 3G / 4G design and enhance system performance while speeding time to market.
Part # TGA2572-FL
The TriQuint TGA2572-FL is a packaged Ku-band power amplifier fabricated on TriQuint's production-released, 0.25um GaN on SiC process. Operating from 14 to 16 GHz, the TGA2572-FL typically provides 43 dBm of saturated output power, 30% power-added efficiency and 23 dB of small signal gain.
Ideally suited for Ku band communications, the TGA2572-FL supports key commercial and defense-related frequency bands.
TriQuint's 0.25um GaN on SiC process offers superior electrical performance through Ku-band while maintaining high reliability. In addition, the use of SiC substrates provides optimum thermal performance necessary for high power operation. Lead-free and RoHS compliant.