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Integrated Assemblies / Packaging Services
TriQuint has expanded its range of customer services to include advanced, integrated assembly and packaging of RF components supporting communications, radar and EW applications. TriQuint can integrate functions within industry-standard or custom packages at die-level or in multi-chip designs. TriQuint packaged products benefit from the same innovative and dependable manufacturing process controls that ensure reliability and functionality for our MMIC device solutions.
- One-Stop Convenience: Fabricate circuits, package die and test components in one secure location for shorter lead times, greater savings.
- Single- and Multi-Chip Assembly: integrate single or multiple die using industry-standard or custom packages.
- Experience and Innovation: Ensure your program success through TriQuint’s expert teams and state-of-the-art facilities.
- Die-on-Tab (DoT): Simplify assembly, increase yields and mitigate thermal considerations through virtually void-free vacuum reflow die attach. The DoT process attaches die-level devices to thermal spreaders for easier handling. All devices are 100% in-factory X-ray inspected.
Contact TriQuint for details about convenient, in-house integrated assembly and packaging services including Die-on-Tab (DoT).
