Process |
TQPED |
TQTRx |
0.35µm |
0.25µm |
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Wafer Size |
150mm |
150mm |
100mm |
100mm |
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Photolithography |
Optical |
Optical |
Optical |
E-Beam |
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Technology |
E-D pHEMT |
E-D MeSFET |
D pHEMT |
D pHEMT |
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Critical Dimension (um) |
0.5 |
0.6 |
0.35 |
0.25 |
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Mask layers including substrate vias |
13 |
16 |
|
|
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Metals |
3-BCB* |
3-BCB* |
3-AB* |
3-AB* |
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MIM C/A (fF/um^2) |
0.6 |
1.2 |
0.24, 0.30, 1.2 |
0.24, 0.30, 1.2 |
|||
TFR (ohms/sqr.) |
50 or 1000 |
50 |
50 |
50 |
|||
Bulk R (ohms/sqr.) |
320 |
700 |
160 |
160 |
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Transistor type |
D |
E |
D |
E |
G |
D |
D |
Vp (V) Typical |
-0.8 |
0.35 |
-0.6 |
0.15 |
-2.2 |
-1.0 |
-1.0 |
Idss (mA/mm) |
230 |
0.1 |
70 |
400 |
300 |
300 |
|
Idh/max (mA/mm) |
515 |
300 |
90 |
|
|
|
|
Gm (mS/mm) |
365 |
600 |
200 |
225 |
170 |
375 |
400 |
BVGD (V) Typical |
19 |
18 |
18.5 |
22 |
19 |
22 |
18 |
* AB = air bridge BCB = Benzocyclobutene