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January 29, 2010
TriQuint highlighted the success of its CuFlip technology, noting shipments of CuFlip based products passed the 100 million mark. The unique interconnect technique enables superior RF performance and design flexibility while offering faster manufacturing and assembly. TriQuint’s highest volume CuFlip product, the TQM7M5012, a HADRON II Power Amplifier Module, utilizes this technology. More than 30 customers have chosen the TQM7M5012 for products ranging from data cards and netbooks to e-readers to a growing array of popular 3G smartphones. To learn more about TriQuint’s CuFlip product, visit http://www.triquint.com/company/innovation/index.cfm