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TriQuint is proud to announce the latest additions to our innovative RF portfolio. View our New Products page to discover ways to simplify your RF designs across mobile, network infrastructure and defense applications.
TriQuint's QUANTUM Tx™ family of highly integrated transmit modules reduce board space and enable a much smaller footprint for 2G / 3G / 4G mobile devices. Find out how these building blocks can make RF design easier and faster for 2G and entry-level 3G devices.
Patented Spatium™ technology from TriQuint delivers a higher standard of efficiency, reliability and frequency range for high-power RF applications including communications, electronic warfare (EW), radar and test and measurement.
TriQuint's innovative TriAccess™ portfolio enables more efficient broadband video, voice and data services. TriQuint amplifiers and filters lower power consumption with improved performance. TriQuint enables all major 75 ohm RF systems in headend, infrastructure, MDU and CPE applications.
Consumers have come to expect Wi-Fi connectivity in their smartphones, tablets and other mobile devices. You'll find TriQuint's TriConnect® Wi-Fi RF modules in many of the world's most sought-after products.
TRITIUM™ is a family of highly integrated modules designed for use in 3G mobile phones, data cards and USB modems. Optimize your 3G CDMA / WCDMA / HSUPA applications and gain maximum design flexibility.
TriQuint's highly integrated TRIUMF™ MMPAs are one more proven way that TriQuint engineers are delivering innovative solutions for the most complex mobile design challenges for cutting-edge smartphones. Let us help you simplify your 2G / 3G / 4G design and enhance system performance while speeding time to market.
President and Chief Executive Officer
Ralph Quinsey joined TriQuint in July 2002 as president and chief executive officer. From September 1999 to January 2002, Mr. Quinsey was with ON Semiconductor, a manufacturer of semiconductors for a wide array of applications, as vice president and general manager of the Analog Division. Prior to that, Mr. Quinsey was with Motorola, a manufacturer of semiconductors and communications equipment, from 1979 to September 1999, holding various positions including vice president and general manager of the RF / IF Circuits Division, which developed both silicon and gallium arsenide technologies for wireless phone applications. In January 2011 Volterra Semiconductor Corporation (Nasdaq:VLTR), a leading provider of high-performance analog and mixed-signal power management semiconductors, appointed Mr. Quinsey to its board of directors. Mr. Quinsey received a B.S. degree in electrical engineering from Marquette University.
Chief Financial Officer
Steve Buhaly joined TriQuint as chief financial officer in September 2007 and has more than 20 years of experience in finance and operations. Prior to joining TriQuint, Mr. Buhaly was chief financial officer at Longview Fibre Company. He joined Planar Systems in 1999 as the medical business vice president and from 2000 to 2005 served first as chief financial officer and then chief operating officer. Before 1999 he held positions of increasing responsibility in finance and operations at Tektronix. Mr. Buhaly received B.S. and M.B.A degrees from the University of Washington.
Vice President, Infrastructure & Defense Products Engineering
Brian P. Balut joined TriQuint in July 2001 as vice president of sales and marketing at Sawtek, Inc., as a result of TriQuint's merger with Sawtek. He was then promoted to vice president of sales and marketing of TriQuint, a position he held from 2002 to May 2004. In May 2004, Mr. Balut was promoted to vice president / general manager of TriQuint Florida. In 2006, after reorganizing the Florida and Oregon locations to be market based, Mr. Balut became vice president / general manager of the newly established Networks business unit. In 2012 after streamlining the organization, Mr. Balut became vice president of engineering for the combined Infrastructure & Defense Products Business Unit. Mr. Balut joined Sawtek in October 1994 as sales manager. He was promoted to director of sales and marketing in November 1996 and to vice president of sales and marketing in September 1998, and assumed overall corporate responsibility for this function in July 2002. From 1987 to 1994, he held various positions in sales, marketing and engineering with REMEC, a manufacturer of electronic components. Mr. Balut received a B.S. degree in electrical engineering from the Massachusetts Institute of Technology and an M.B.A. from Rollins College.
Vice President, Human Resources
Deborah Burke joined TriQuint in May 2007 as vice president of the company's human resources department, guiding HR activities in major design / manufacturing facilities as well as sales, field application support and design center offices in North America, Europe, Asia and the company's manufacturing facility in Costa Rica. Prior to joining TriQuint, Ms. Burke was vice president of human resources for Merix Corporation where she oversaw the company's HR needs through periods of rapid growth and an expansion of manufacturing facilities in China and other regions. Before her Merix Corporation tenure, she was vice president of human resources for Unicru of Beaverton, Oregon, and worked at Intel Corporation for 10 years in managerial and director positions with assignments in Oregon, Malaysia and Israel. Ms. Burke holds a B.A. in economics from Smith College and received her M.B.A degree from the University of Vermont.
Vice President, Global Sales and Strategic Development
Todd DeBonis joined TriQuint in April 2004 as vice president of worldwide sales. He became vice president of worldwide sales and customer service in 2006 and added strategic development to his list of responsibilities in 2010. From February 2002 to April 2004, Mr. DeBonis held the position of vice president of worldwide sales and marketing at Centillium Communications. Mr. DeBonis also served as the vice president of worldwide sales for Ishoni Networks and vice president of sales and marketing for the Communications division of Infineon Technologies North America. Mr. DeBonis has a B.S degree in electrical engineering from the University of Nevada.
Vice President, Custom Products
Tim Dunn joined TriQuint in July 2006 as vice president and general manager of the company's Mobile Devices group and leads TriQuint's development and marketing of next-generation, custom RF modules and components. Prior to joining TriQuint, Mr. Dunn was vice president and general manager of Intel's Platform Components Group where he worked to realize the company's platform vision by developing leading networking and chipset products. Mr. Dunn worked at Intel from 1988 to 1991, and again from 1994 to 2006, holding various executive and managerial positions. In addition to his tenure at Intel, he has held marketing and product management positions with Hewlett-Packard and Cirrus Logic. Mr. Dunn holds an M.B.A. from the Amos Tuck School of Business at Dartmouth College and a B.S. in electrical engineering from Oregon State University.
Vice President, Oregon Operations
Gadi Dvir joined TriQuint as vice president of Oregon operations in February 2013. Mr. Dvir brings his vast experience in the technology and manufacturing industries to this role. He spent 25 years at Intel Corporation in management positions throughout the company at a variety of sites, including the Fab 8 facility in Jerusalem, Israel, and Fab 17 in Hudson, Massachusetts. Mr. Dvir's roles during his time at Intel included IT, manufacturing, materials / logistics, operations, automation integration, strategic planning and engineering. Mr. Dvir is credited with significant improvements in manufacturing cost, yield and cycle time at all the sites he managed. Prior to his time at Intel, Mr. Dvir spent 10 years in the Israel Defense Forces and in the private market as an IT professional and manager. Most recently, Mr. Dvir had been a management consultant to one of the U.S. government agencies. Mr. Dvir has a B.S. in math and physics from Hebrew University in Jerusalem, Israel, and studied business management at Rekanaty Business School in Tel Aviv.
Vice President, Business Development
Bruce R. Fournier joined TriQuint during its start-up phase in June 1987. Since that time, he has held a variety of positions including vice president of worldwide sales from September 1994 to June 1998. From June 1998 until May 2002, Mr. Fournier held the position of vice president and general manager of Foundry Services and subsequently was appointed to the position of vice president of TriQuint Oregon. In 2006 he became the vice president for TriQuint's business development activities. Prior to joining TriQuint, Mr. Fournier held engineering, sales and marketing management positions with Fairchild Semiconductor, Weitek Corporation and Honeywell, Inc. Mr. Fournier received an A.S. degree in electrical engineering and a B.S. degree in business administration from the University of Maine and an M.B.A. from the University of Southern Maine.
Vice President, Worldwide Operations
Steven R. Grant joined TriQuint in July 2008 as vice president of worldwide operations. Mr. Grant is highly experienced in semiconductor manufacturing and engineering. Prior to joining TriQuint, he spent 27 years at Intel Corporation and was most recently vice president of Intel's Technology and Manufacturing Group in Oregon. During his Intel tenure, he managed the fab manufacturing network and was key to driving the manufacturing structure and efficiency improvements to record performance levels. Mr. Grant holds a B.S. in materials science from the University of Illinois.
Vice President, Infrastructure & Defense Products
James L. Klein joined TriQuint in July 2011 as vice president of Defense Products & Foundry Services and was responsible for strategic direction, product roadmap and technology development. In 2012 after streamlining the organization, Mr. Klein became vice president for the combined Infrastructure & Defense Products Business Unit, which includes the company's foundry business. Prior to joining TriQuint, Mr. Klein spent 13 years with Raytheon where he most recently served as the general manager of the Advanced Products Center for Raytheon's space and airborne systems. Mr. Klein was with Texas Instruments in program management and engineering roles within the Defense Systems Equipment Group from 1988–1998. He holds both B.S. and M.S. degrees in electrical engineering from Texas A&M University.
Vice President, Custom Products Central Engineering
Thomas Meier joined TriQuint in 2002 as managing director of the Munich Design Center. He was promoted to vice president in 2009 and is responsible for TriQuint's mobile devices product development. Prior to joining TriQuint, Mr. Meier spent 17 years with Infineon / Siemens where he held a variety of engineering and engineering management positions, including the head of GaAs product development and head of development of RF power components. Mr. Meier has a master's degree in electrical engineering from the University of Erlangen, Germany.
Glen Riley joined TriQuint in 2003 and most recently completed a two-year assignment in Singapore as managing director of TriQuint International Pte Ltd. Prior roles at TriQuint include vice president and general manager of Foundry Services and vice president and general manager of TriQuint Optoelectronics. Before joining TriQuint, Mr. Riley was the CEO of Opticalis, a venture-funded start-up company, and was a senior executive with Agere Systems as vice president of optical core networks, president of Asia-Pacific sales and general manager of storage products. Earlier in his career, Mr. Riley held positions in sales and marketing at Philips Semiconductors, AT&T Microelectronics and Texas Instruments. Mr. Riley holds a B.S. degree with highest distinction in electrical engineering from the University of Maine and completed the general manager program at Harvard Business School.
Vice President, Mobile Products
Sean Riley joined TriQuint in January 2013 as senior director of technology planning and advanced development. He was promoted to vice president and general manager of mobile products in November 2013. He drives strategic direction and product development of TriQuint's innovative RF solutions for next-generation smartphones and other mobile devices. During his 20-year career, Mr. Riley has worked in a range of engineering, marketing and management positions with several technology companies. Prior to joining TriQuint, he was vice president and general manager of the infrastructure business unit at Lattice Semiconductor Corporation. This followed his position as vice president of marketing at MathStar. Mr. Riley also served as director of Intel's planning, networking and storage group. He holds a master's degree in electrical engineering from Arizona State University.
Vice President, Florida and Costa Rica Operations
Azhar Waseem joined TriQuint in July 2001 as vice president / general manager, TriQuint Florida and Costa Rica, as a result of TriQuint's merger with Sawtek. Mr. Waseem joined Sawtek in March 1995 as director of wafer fabrication and was promoted to vice president of manufacturing in April 1998 and to vice president of operations in October 1999. From 1989 to 1994, Mr. Waseem held various operations and engineering positions with Siliconix, Inc., a microelectronics manufacturer based in Santa Clara, California. From 1979 to 1989, Mr. Waseem held various engineering and management positions with General Electric and other semiconductor companies. Mr. Waseem received B.S. and M.S. degrees in electrical engineering and an M.B.A., all from the University of Minnesota.
Vice President, Texas Operations
Howard S. Witham joined TriQuint in January 2010 as vice president of Texas operations, with responsibility for overseeing TriQuint's Texas facilities. Prior to joining TriQuint, he worked for 16 years at STMicroelectronics where he was most recently director of manufacturing and site operations at the 200 mm sub-micron silicon fab in Phoenix, Arizona. While at STMicroelectronics, he also served in other leadership roles including oversight of the STMicroelectronics research and development fab in Ottawa, Canada, and worldwide facilities operations. Dr. Witham holds a B.S. in electrical engineering, an M.S. in engineering science and a Ph.D. in engineering science and mechanics, all from The Pennsylvania State University.